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January 2025
Service Hotline：400-810-0466
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Cools ultra-dense supercomputer chips that traditional air cooling can no longer handle.
The Sugon C7000 liquid-cooling infrastructure system is a new infrastructure solution launched by Sugon to solve supporting cooling for liquid-cooled servers. In cooling method, it breaks through traditional air cooling and uses an “air + liquid” hybrid mode: main heat-source chips inside servers are cooled by liquid-cooling cold plates, while remaining heat sources still use air cooling.
The liquid-cooling system consists of liquid-cooled servers, liquid-cooling heat-exchange modules, outdoor cold sources, and piping-engineering systems; liquid-cooled servers and heat-exchange modules are fully independently designed by Sugon. The air-cooling part is matched with the Sugon C2000 pool-level micro-module architecture, further raising cooling efficiency through hot/cold airflow isolation.
Main heat-generating components use liquid cooling; the outdoor side can use year-round free cooling, substantially lowering air-conditioning energy, with annual average PUE as low as below 1.2.
Lower PUE lets the data center save substantial electricity each year, greatly lowering O&M cost and thus data-center TCO.
Chips work long-term at relatively low core temperature, fully unleashing performance and raising overall cluster performance.
Liquid cooling cuts server noise to below 60 dB(A), far below ordinary air-cooled servers, for a more comfortable O&M environment.
+86 400-810-0466
international@sugon.com
津公网安备 12011602000521号
+86 400-810-0466
international@sugon.com
津公网安备 12011602000521号
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